3D Circuit and System Design: Multicore Architecture, Thermal Management, and Reliability Rohit Sharma

ISBN: 9781466589407

Published: September 18th 2014

Hardcover

450 pages


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3D Circuit and System Design: Multicore Architecture, Thermal Management, and Reliability  by  Rohit Sharma

3D Circuit and System Design: Multicore Architecture, Thermal Management, and Reliability by Rohit Sharma
September 18th 2014 | Hardcover | PDF, EPUB, FB2, DjVu, talking book, mp3, RTF | 450 pages | ISBN: 9781466589407 | 6.61 Mb

3D integration of microsystems and subsystems has become imperative to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this verticalMore3D integration of microsystems and subsystems has become imperative to the future of semiconductor technology development.

3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity.This book tackles all aspects of 3D integration, including 3D circuit and system design, new process development, application of novel materials, and thermal challenges for restricting power dissipation. Presenting a coherent approach that takes into account distinct yet interrelated issues, the text discusses the use of interposer technology and the role of through-silicon vias (TSVs), as well as revisits traditional cooling techniques in view of the vertical interconnection of stacked subsystems.



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